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sense & control datasheet rev.1.0, 2010-06-28 TLE4966-2K high precision hall switch with two outputs
edition 2010-06-28 published by infineon technologies ag 81726 munich, germany ? 2010 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
datasheet 3 rev.1.0, 2010-06-28 TLE4966-2K trademarks of infineon technologies ag abm?, bluemoon?, convergate?, cosic?, c166?, falc?, geminax?, goldmos?, isac?, omnitune?, omnivia?, prosoc?, serocco?, sicofi?, sieget?, smarti?, smint?, socrates?, vinax?, vinetic?, voipro ?, x-gold?, xmm?, x-pmu?, xway? other trademarks microsoft ? , visio ? , windows ? , windows vista ? , visual studio ? , win32 ? of microsoft corporation. linux ? of linus torvalds. framemaker ? , adobe ? reader?, adobe audition ? of adobe systems incorporated. apoxi ? , comneon? of comneon gmbh & co. ohg. primecell ? , realview ? , arm ? , arm ? developer suite? (ads), multi-ice?, arm1176jz-s?, coresight?, embedded trace macrocell? (etm), thumb ? , etm9?, amba?, arm7?, arm9?, arm7tdmi-s ?, arm926ej-s? of arm limited. oakdspcore ? , teaklite ? dsp core, ocem ? of parthusceva inc. indoorgps?, gl-20000?, gl-ln-22? of global locate. mipi? of mipi alliance. cat-iq? of dect forum. mips?, mips ii?, 24kec?, mips32 ? , 24kec? of mips technologies, inc. texas instruments ? , powerpad?, c62x?, c55x?, vlynq?, telogy software?, tm s320c62x?, code composer studio?, ssi? of texas instru ments incorporated. bluetooth ? of bluetooth sig, inc. irda ? of the infrared data association. java?, sunos?, solaris? of sun microsystems, inc. philips ? , i2c-bus ? of koninklijke philips electronics n.v. epson ? of seiko epson corporation. seiko ? of kabushiki kaisha hatt ori seiko corporation. panasonic ? of matsushita electric industrial co., ltd. murata ? of murata manufacturing company. taiyo yuden? of taiyo yuden co., ltd. tdk ? of tdk electronics company, ltd. motorola ? of motorola, inc. national semiconductor ? , microwire? of national semi conductor corporation. ieee ? of the institute of electrical and electronics engineers, inc. samsung ? , onenand ? , utram ? of samsung corporation. toshiba ? of toshiba corporation. dalla s semiconductor ? , 1-wire ? of dallas semiconductor corp. iso ? of the international organization for standardization. iec? of the internat ional engineering consortium. emv? of emvco, llc. zetex ? of zetex semiconductors. microtec ? of microtec research, inc. verilog ? of cadence design systems, inc. ansi ? of the american national sta ndards institute, inc. windriver ? and vxworks ? of wind river systems, inc. nucleus? of mentor graphics corporation. omnivision ? of omnivision technologies, inc. sharp ? of sharp corporation. symbian os ? of symbian software ltd. openwave ? of openwave systems, inc. maxim ? of maxim integrated products, inc. spansion ? of spansion llc. micron ? , cellularram ? of micron technology, inc. rfmd ? of rf micro devices, inc. epcos ? of epcos ag. unix ? of the open group. tektronix ? of tektronix, inc. intel ? of intel corpor ation. qimonda ? of qimonda ag. 1gonenand ? of samsung corporation. hyperterminal ? of hilgraeve, inc. matlab ? of the mathworks, inc. red hat ? of red hat, inc. palladium ? of cadence design systems, inc. sirius satellite radio ? of sirius satellite radio inc. toko ? of toko inc. the information in this document is subject to change without notice. last trademarks update 2008-11-17 revision history: 2010-06-28, rev.1.0 previous revision: page subjects (major cha nges since last revision)
datasheet 4 rev.1.0, 2010-06-28 TLE4966-2K trademarks of infineon technologies ag . . . . . . . . . . . . . . . . . . . . . . 3 1overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.2 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.3 pin configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 general . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 circuit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 operating range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 electrical and magnetic parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 field direction definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6 timing diagrams fo r the speed outputs . . . . . . . . . . . . . . . . . . . . . . . . 11 7 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7.1 package marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7.2 distance between chip and package surface . . . . . . . . . . . . . . . . . . . . . . 12 7.3 package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 pcb footprint for pg-tsop6-6-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
product name product type ordering code package TLE4966-2K double hall switch sp000788888 pg-tsop6-6-5 high precision hall swit ch with two outputs TLE4966-2K datasheet 5 rev.1.0, 2010-06-28 1overview 1.1 features ? 2.7v to 24v supply voltage operation ? operation from unregulated power supply ? high sensitivity and high stability of the magnetic switching points ? high resistance to mechanical stress by active error compensation ? reverse battery protection (-18v) ? superior temper ature stability ? peak temperatures up to 195c ? low jitter (typ. 1 s) ? digital output signals ? excellent matching of the 2 hall probes ? hall plate distance 1.45mm ? two independent speed outputs ? smd package pg-tsop6-6-5 1.2 functional description the TLE4966-2K is an integrated circuit dual hall-effe ct sensor designed specific ally for highly accurate applications. precise magnetic swit ching points and high temperature stability are achieved by active compensation circuits and chopper techniques on chip. the sensor provides two independent speed outputs at q1 and q2 with the status (high or low) corresponding to the magnetic field value at the respective hall element h1 and h2. both hall el ements have the identical thresholds for b op and b rp (b op1 = b op2 and b rp1 = b rp2 ). for positive magnetic fields (south pole) exceeding the threshold b op1 and/or b op2 the corresponding output q1 and/or q2 is low, whereas for negative magnet ic fields (north pole) lower than b rp the output switches to high. due to the spatial distance of the two hall elements on the chip (d = 1.45mm) the two output signals will show a phase difference in case the sensor is used with a rotating magnetized pole wheel.
datasheet 6 rev.1.0, 2010-06-28 TLE4966-2K overview 1.3 pin configuration (top view) figure 1 pin definition and center of sensitive area table 1 pin definitions and functions pin no. symbol function 1 q2 speed 2 2 gnd recommended connection to gnd 3 q1 speed 1 4 v dd supply voltage 5 gnd recommended connection to gnd 6 gnd ground aea03645 66 year (y) = 0...9 month (m) = 1...9, o - october n - november d - decembe r s y m 123 4 5 pg-tsop6-6-5 0.15 0.73 0.15 0.8 6 1.45 center of sensitive area speed 2 speed 1
datasheet 7 rev.1.0, 2010-06-28 TLE4966-2K general 2 general 2.1 block diagram figure 2 block diagram 2.2 circuit description the chopped dual hall switch comprise s two hall probes, bias generator, comp ensation circuits, oscillator, and output transistors. the bias generator provides currents for the hall probes an d the active circuits. compens ation circuits stabilize the temperature behavior and reduce influence of technology variations. the active error compensation rejects of fsets in signal stages and the influence of mechanical stress to the hall probes caused by molding and solder ing processes and other thermal stre sses in the package. this chopper technique together with the threshold generator and the comparator ensures high ac curate magnetic switching thresholds. voltage regulator (reverse polarity protected ) oscillator & sequencer bias and compensation circuits filter filter amplifier amplifier chopped hall probe esd v dd q2 comparator with hysteresis q1 gnd chopped hall probe
datasheet 8 rev.1.0, 2010-06-28 TLE4966-2K maximum ratings 2.3 application circuit it is recommended to use a series resistor r s with 200 : and a capacitor of c s = 4.7nf for protection against overvoltage and transients on the supply line. pull-up resistors c s q 1 q 2 gnd TLE4966-2K v dd r s r l r l v s r l are required for the output pins q 1 and q 2 . figure 3 application circuit 3 maximum ratings note: stresses above those listed here may cause perma nent damage to the device. exposure to absolute maximum rating conditions for extended periods may af fect device reliability. ma ximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. table 2 absolute maximum ratings t j = -40c to 150c parameter symbol limit values unit conditions min. max. supply voltage v dd v s v s -18 -18 -18 18 24 26 v for 1 h, r s t 200 : for 5 min, r s t 200 : supply current through protection device i dd -50 50 ma output voltage v q -0.7 -0.7 18 26 v for 5 min @ 1.2 k : pull up continuous output current i q -50 50 ma junction temperature t j ? ? ? ? 155 165 175 195 c for 2000 h (not additive) for 1000 h (not additive) for 168 h (not additive) for 3 x 1 h (additive) storage temperature t s -40 150 c magnetic flux density b ? unlimited mt
table 3 esd protection 1) 1) human body model (hbm) tests according to: eos/esd a ssociation standard s5.1-1993 and mil. std. 883d method 3015.7 parameter symbol limit values unit notes min. max. esd voltage v esd ? 4 kv hbm , r = 1.5 k : , c = 100 pf t a = 25c datasheet 9 rev.1.0, 2010-06-28 TLE4966-2K operating range 4 operating range the following operating conditions must not be exceeded in order to ensure correct operation of the TLE4966-2K. all parameters specified in the following sections refer to theses operating conditions unless otherwise mentioned. table 4 operating range parameter symbol limit values unit conditions min. typ. max. supply voltage v dd v s v s 2.7 ? ? ? ? ? 18 24 26 v 1 h with r s t 200 : for 5 min r s t 200 : output voltage v q -0.7 ? 18 v junction temperature t j -40 ? ? ? 150 175 c for 168 h output current i q 0?10ma
datasheet 10 rev.1.0, 2010-06-28 TLE4966-2K electrical and magnetic parameters 5 electrical and magnetic parameters product characteristics involve the spread of values g uaranteed within the specified voltage and temperature range. typical characteristics are the median of the production. table 5 electrical characteristics 1) 1) over operating range, unless otherwise specified. typical values correspond to v dd = 12 v and t a = 25c parameter symbol limit values unit conditions min. typ. max. supply current i dd 45.27 ma v dd = 2.7 v ... 18 v reverse current i sr 00.21 ma v dd = -18 v output saturation voltage v qsat ?0.30.6v i q = 10 ma output leakage current i qleak ?0.0510 afor v q = 18 v output fall time t f ?0.21 s r l = 1.2 k ; c l < 50 pf see: figure 4 on page 11 output rise time t r ?0.21 s chopper frequency f osc ? 320 ? khz switching frequency f sw 0? 15 2) 2) to operate the sensor at the max. s witching frequency, the magnetic signal amp litude must be 1.4 times higher than for static fields. this is due to the -3 db corner fr equency of the low pass filter in the signal path. khz delay time 3) 3) systematic delay between magnetic threshold reached and output switching t d ?13? s count signal delay t dc 50 200 1000 ns output jitter 4) 4) jitter is the unpredictable devia tion of the output switching delay t qj ?1 ? s rms typ. value for square wave signal 1 khz repeatability of magnetic thresholds 5) 5) b rep is equivalent to the noise constant b rep ?40? t rms typ. value for / > 12 mt/ms power-on time 6) 6) time from applying v dd 2.7 v to the sensor until the output state is valid t pon ?13? s v dd 2.7 v distance of hall plates d hall ?1.45? mm thermal resistance 7) 7) thermal resistance from junction to ambient calculation of the ambient temperature (pg-tsop6-6-5 example) e.g. for v dd = 12.0 v, i ddtyp = 5.5 ma, v qsattyp = 0.3 v and 2 x i q = 10 ma : power dissipation: p dis = 72.0 mw. in t a = t j ? ( r thja p dis ) = 175c ? (100 k / w 0.072 w) resulting max. ambient temperature: t a = 167.8c r thja ? 100 ? k/w pg-tsop6-6-5
datasheet 11 rev.1.0, 2010-06-28 TLE4966-2K timing diagrams for the speed outputs note: typical characteristics specify mean values expected over the production spread. field directio n definition positive magnetic fields related with south pole of the magnet to the branded side of package. 6 timing diagrams fo r the speed outputs figure 4 timing definition of the speed signal table 6 magnetic characteristics 1) . 1) over operating range, unless otherwise specified. typical values correspond to v dd = 12 v parameter symbol t j [c] limit values unit conditions min. typ. max. operate point op1, b op2 -40 25 150 5.2 5.0 4.7 7.7 7.5 7.1 10.3 10.0 9.5 mt b op1 for hall element 1 b op2 for hall element 2 release point rp1 , b rp2 -40 25 150 -10.3 -10.0 -9.5 -7.7 -7.5 -7.1 -5.2 -5.0 -4.7 mt b rp1 for hall element 1 b rp2 for hall element 2 hysteresis hys1 , b hys2 -40 25 150 ? 10.0 ? ? 15.0 ? ? 20.0 ? mt b hys1 = b op1 - b rp1 b hys2 = b op2 - b rp2 magnetic matching match -40 25 150 ? -2.0 ? ? 0 ? ? 2.0 ? mt valid for op1 - b op2 and rp1 - b rp2 magnetic offset off1 , b off2 -40 25 150 ? -2.0 ? ? 0 ? ? 2.0 ? mt b off1 = ( b op1 + b rp1 )/2 b off2 = ( b op2 + b rp2 )/2 temperature compensation of magnetic thresholds tc ??-350? ppm/c applied magnetic field 90% 10% v q t f t d t r t d b op b rp
datasheet 12 rev.1.0, 2010-06-28 TLE4966-2K package information 7 package information 7.1 package marking z2 year (y) = 0 ...9 month ( m) = 1...9 , o - october n-november d-december s y m figure 5 marking pg-tsop6-6-5 7.2 distance between chip and package surface branded side d mm 0.1 0.56 figure 6 distance chip to upper side of ic 7.3 package outlines figure 7 pg-tsop6-6-5 (plastic thin small outline package) 1.6 ?.1 2.6 max. 1.1 max. acc. to din 6784 +0.2 0.1 max. (2.25) +0.1 -0.05 0.35 (0.35) gpx09300 10 ? max. 10 ? max. 2.9 ?.2 b 0.2 m b 6x 0.95 1.9 a 0.2 a m 0.15 +0.1 -0.06 3 2 1 4 5 6
datasheet 13 rev.1.0, 2010-06-28 TLE4966-2K package information pcb footprint for pg-tsop6-6-5 the following picture shows a recommendation for the pcb layout. 0.5 0.95 1.9 2.9 hlg09283 r emark: wave soldering possible dep. on customers process condition s figure 8 footprint pg-tsop6-6-5 you can find all of our packages, sorts of packing and others in our infineon internet page ?products?: http://www.infineon.com/products . dimensions in mm
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